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California co. announces fully sustainable, hydrogen-powered data center in Houston

The 1-gigawatt site will be constructed at a cost of approximately $8 billion. Photo courtesy ECL

The Houston area will soon be home to what's being lauded as the first fully sustainable 1-gigawatt data center on a 600-acres site east of Houston.

Data center-as-a-service company ECL, headquartered in Mountain View, California, announced its plans to build the ECL TerraSite-TX1. Hardware and cloud service company Lambda will serve as its first tenant. Lambda and other AI leaders will get access to necessary space and power for the next wave zero emission innovations.

Phase 1 of TerraSite-TX1 will be complete by summer of 2025 with a cost of approximately $450 million. The 50 megawatt of data center capacity will be utilized by data center cloud and AI cloud operators. The 1-gigawatt site will be constructed at a cost of approximately $8 billion. The funding will come from ECL and financial partners.

ECL Terrasite-TX1 comes at a needed time for Texas with The Electric Reliability Council of Texas stating on June 12 that the state’s power grid needs will grow approximately double by 2030. This is due in part to the growth of data centers and AI. The ECL Terrasite-TX1 is built to help eliminate the stress on the state’s power grid and help facilitate “state-level economic development and growth of the AI industry,” according to a news release.

ECL houston data centerThe project will span over 600 acres east of Houston. Rendering courtesy ECL

ECL data centers are built to be modular, which allows for expansion in 1-megawatt increments. They are “ built to suit” and delivered in less than 12 months, which is shorter than the industry standard of 36 to 48.

“While others talk about delivering off-grid, hydrogen-powered data centers in five, ten, or 20 years, only ECL is giving the AI industry the space, power, and peace of mind they and their customers need, now,” Yuval Bachar, co-founder and CEO of ECL, says in a news release. “The level of innovation that we have introduced to the market is unprecedented and will serve not only us and our customers but the entire data center industry for decades to come.”

ECL’s ECL-MV1 is the world’s first off-grid, hydrogen-powered modular data center that operates 24/7 with zero emissions, less noise, and a negative water footprint that replenishes water to the community. ECL-MV1 offers a 10x increase in “energy efficiency with a power usage effectiveness of 1.05 and a 7-times improvement in data density per rack, which is ideal for AI high-density demand” according to the release.

“The data center technology committed to by ECL is truly transformative in the industry,” Lambda's Vice President for Data Center Infrastructure Ken Patchett adds. “We believe ECL’s technology could unlock a powerful and eco-conscious foundation for AI advancement. This new infrastructure could give researchers and developers essential computational resources while drastically reducing the environmental impact of AI operations.”

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A View From HETI

UH researchers have developed a thin film that could allow AI chips to run cooler and faster. Photo courtesy University of Houston.

A team of researchers at the University of Houston has developed an innovative thin-film material that they believe will make AI devices faster and more energy efficient.

AI data centers consume massive amounts of electricity and use large cooling systems to operate, adding a strain on overall energy consumption.

“AI has made our energy needs explode,” Alamgir Karim, Dow Chair and Welch Foundation Professor at the William A. Brookshire Department of Chemical and Biomolecular Engineering at UH, explained in a news release. “Many AI data centers employ vast cooling systems that consume large amounts of electricity to keep the thousands of servers with integrated circuit chips running optimally at low temperatures to maintain high data processing speed, have shorter response time and extend chip lifetime.”

In a report recently published in ACS Nano, Karim and a team of researchers introduced a specialized two-dimensional thin film dielectric, or electric insulator. The film, which does not store electricity, could be used to replace traditional, heat-generating components in integrated circuit chips, which are essential hardware powering AI.

The thinner film material aims to reduce the significant energy cost and heat produced by the high-performance computing necessary for AI.

Karim and his former doctoral student, Maninderjeet Singh, used Nobel prize-winning organic framework materials to develop the film. Singh, now a postdoctoral researcher at Columbia University, developed the materials during his doctoral training at UH, along with Devin Shaffer, a UH professor of civil engineering, and doctoral student Erin Schroeder.

Their study shows that dielectrics with high permittivity (high-k) store more electrical energy and dissipate more energy as heat than those with low-k materials. Karim focused on low-k materials made from light elements, like carbon, that would allow chips to run cooler and faster.

The team then created new materials with carbon and other light elements, forming covalently bonded sheetlike films with highly porous crystalline structures using a process known as synthetic interfacial polymerization. Then they studied their electronic properties and applications in devices.

According to the report, the film was suitable for high-voltage, high-power devices while maintaining thermal stability at elevated operating temperatures.

“These next-generation materials are expected to boost the performance of AI and conventional electronics devices significantly,” Singh added in the release.

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This article originally appeared on our sister site, InnovationMap.

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