Top Honor

4 Houston inventors named to prestigious national organization

Birol Dindoruk is known for his research in carbon capture and storage, fluid-rock interactions and hydrogen storage. Courtesy photo

Houston is home to four new senior members of the National Academy of Inventors.

To be eligible to be an NAI Senior Member, candidates must be active faculty, scientists and administrators from NAI member institutions that have demonstrated innovation and produced technologies that have “brought, or aspire to bring, real impact on the welfare of society,” according to the NAI. The members have also succeeded in patents, licensing and commercialization, and educating and mentoring.

The University of Houston announced that three professors were selected to join the prestigious NAI list of senior members. UH now has 39 faculty members on the NAI list.

“We congratulate these three esteemed colleagues on being named NAI Senior Members,” Ramanan Krishnamoorti, vice president for energy and innovation at UH, said in a news release. “This recognition is a testament to their dedication, research excellence and pursuit of real-world impact by knowledge and technologies. Their achievements continue to elevate the University as a leader in innovation and entrepreneurship.”

UH’s new senior members include:

  • Birol Dindoruk, the American Association of Drilling Engineers Endowed Professor of Petroleum Engineering and Chemical and Biomolecular Engineering at the Cullen College of Engineering. He is known for his research in carbon capture and storage, fluid-rock interactions and hydrogen storage. He holds three patents.
  • Megan Robertson, the Neal R. Amundson professor of chemical and biomolecular engineering at UH’s Cullen College of Engineering. She is developing new polymers and groundbreaking strategies for recycling and reusing plastics. Robertson currently has three patents and two more patent applications pending.
  • Francisco Robles Hernandez, a professor of mechanical engineering technology at the UH College of Technology. He holds four patents, and several others are under review. His work focuses on carbon materials, including pioneering work with graphene and designs with steel and aluminum used in automotives and railroads.

“Being named a senior member is both an honor and a responsibility, and I appreciate UH for nurturing an environment where creativity and innovation are not just encouraged but expected,” Dindoruk said. “Ultimately, this milestone is not just about past achievements. It is about future opportunities to innovate, collaborate and make a meaningful impact on both industry and society.”

Allison Post, associate director of electrophysiology research and innovations and manager of innovation partnerships at the Texas Heart Institute at Baylor College of Medicine, also made the list. Post was recognized for her work in biomedical engineering and commitment to advancing cardiovascular care through innovations. Post is the youngest member to be inducted this year.

Other notable Texas honorees include Emma Fan from the University of Texas, Arum Han from Texas A&M and Panos Shiakolas at UT Arlington.

In 2024, Edward Ratner, a computer information systems lecturer in the Department of Information Science Technology at the University of Houston’s Cullen College of Engineering, and Omid Veiseh, a bioengineer at Rice University and director of the Biotech Launch Pad, were named NAI fellows.

The Senior Member Induction Ceremony will honor the 2025 class at NAI’s Annual Conference June 23-26 in Atlanta, Georgia.

---

A version of this story first appeared on our sister site, InnovationMap.com.

Trending News

A View From HETI

UH researchers have developed a thin film that could allow AI chips to run cooler and faster. Photo courtesy University of Houston.

A team of researchers at the University of Houston has developed an innovative thin-film material that they believe will make AI devices faster and more energy efficient.

AI data centers consume massive amounts of electricity and use large cooling systems to operate, adding a strain on overall energy consumption.

“AI has made our energy needs explode,” Alamgir Karim, Dow Chair and Welch Foundation Professor at the William A. Brookshire Department of Chemical and Biomolecular Engineering at UH, explained in a news release. “Many AI data centers employ vast cooling systems that consume large amounts of electricity to keep the thousands of servers with integrated circuit chips running optimally at low temperatures to maintain high data processing speed, have shorter response time and extend chip lifetime.”

In a report recently published in ACS Nano, Karim and a team of researchers introduced a specialized two-dimensional thin film dielectric, or electric insulator. The film, which does not store electricity, could be used to replace traditional, heat-generating components in integrated circuit chips, which are essential hardware powering AI.

The thinner film material aims to reduce the significant energy cost and heat produced by the high-performance computing necessary for AI.

Karim and his former doctoral student, Maninderjeet Singh, used Nobel prize-winning organic framework materials to develop the film. Singh, now a postdoctoral researcher at Columbia University, developed the materials during his doctoral training at UH, along with Devin Shaffer, a UH professor of civil engineering, and doctoral student Erin Schroeder.

Their study shows that dielectrics with high permittivity (high-k) store more electrical energy and dissipate more energy as heat than those with low-k materials. Karim focused on low-k materials made from light elements, like carbon, that would allow chips to run cooler and faster.

The team then created new materials with carbon and other light elements, forming covalently bonded sheetlike films with highly porous crystalline structures using a process known as synthetic interfacial polymerization. Then they studied their electronic properties and applications in devices.

According to the report, the film was suitable for high-voltage, high-power devices while maintaining thermal stability at elevated operating temperatures.

“These next-generation materials are expected to boost the performance of AI and conventional electronics devices significantly,” Singh added in the release.

---

This article originally appeared on our sister site, InnovationMap.

Trending News