Rice University semiconductor researchers join DARPA-funded Texas team

innovation station

Researchers from Rice University and the University of Texas have teamed up for semiconductor microsystem innovation. Photo courtesy of UT

A team led by the University of Texas at Austin and partnered with Rice University was awarded $840 million to develop “the next generation of high-performing semiconductor microsystems" for the U.S. Department of Defense.

The Defense Advanced Research Projects Agency (DARPA) selected UT’s Texas Institute for Electronics (TIE) semiconductor consortium to establish a national open access R&D and prototyping fabrication facility.

The facility hopes to enable the DOD to create higher performance, lower power, lightweight, and compact defense systems. The technology could apply to radar, satellite imaging, unmanned aerial vehicles, or other systems, and ultimately will assist with national security and global military leadership. As a member of DARPA’s Next Generation Microelectronics Manufacturing (NGMM) team, Rice’s contributions are key.

Executive vice president for research Ramamoorthy Ramesh and the Rice researchers will focus on technologies for improving computing efficiency. In a Rice press release, Ramesh notes the need to enhance “energy-efficient computing” which highlights Rice’s qualifications to contribute to the solution.

New microsystem designs will be enabled by 3D heterogeneous integration (3DHI)semi, which is a semiconductor fabrication technology that integrates diverse materials and components into microsystems via precision assembly technologies.

Kepler Computing, is a member of the NGMM team and utilizes ferroelectrics to develop energy-efficient approaches in computer memory and logic, and was co-founded by Ramesh. Other Rice researchers include:

Lane Martin, director of the Rice Advanced Materials Institute
Ashok Veeraraghavan, chair of electrical and computer engineering
Pulickel Ajayan, the Benjamin M. and Mary Greenwood Anderson Professor of Engineering and founding chair of the materials science and nanoengineering department
Kaiyuan Yang, associate professor of electrical and computer engineering
Guha Balakrishnan, assistant professor of electrical and computer engineering

“Given the rapid growth of machine learning AI applications, there is a pressing need to fundamentally rethink current computing methodologies to advance the next generation of microelectronics,” Ramesh says in a news release. ”Rice University boasts world-class researchers with exceptional expertise in computer and electrical engineering poised to bolster this critical federally funded initiative.”

Overall, the project represents a total investment of $1.4 billion. The $840 million award from DARPA is a return on the Texas Legislature’s $552 million investment in TIE. TIE has funded the update of two UT fabrication facilities.

“TIE is tapping into the semiconductor talent available in Texas and nationally to build an outstanding team of semiconductor technologists and executives that can create this national center of excellence in 3DHI microsystems,” S.V. Sreenivasan, TIE founder and chief technology officer and UT professor of mechanical engineering adds.

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Houston researchers propose model to scale e-waste recycling

critical research

The “missing link” in critical minerals may have been in our junk drawers all along, according to new research from the University of Houston.

Jian Shi, an associate professor in the UH Cullen College of Engineering, and his team have unveiled a new supply chain model that aims to make e-waste economically viable and could help make large-scale recycling possible.

Shi, along with professor Kailai Wang and graduate researcher Chuyue Wang, published the work in a recent issue of Nature. Their study outlines how gold, lithium and cobalt from discarded electronics can be kept circulating in the U.S. through the process of “urban mining.” It was supported by the U.S. Department of Energy’s Office of Energy Efficiency and Renewable Energy (EERE) through the Vehicle Technologies Office.

The team’s research found that e-waste is the fastest-growing solid waste stream in the world. When waste from smartphones or tablets is left unmanaged, the devices can leak hazardous waste and pose significant fire risks due to aging batteries. Additionally, when they are shipped off to foreign landfills, the U.S. loses the potential to recycle or reuse the critical minerals left inside.

“A lot of people have iPads or old iPhones sitting in their drawers right now, and that’s a waste of a critical resource,” Shi said in a news release. “Urban mining allows us to extract the same high-value materials found in traditional mines without the environmental destruction. More importantly, it helps secure our domestic supply chain for the technologies of tomorrow.”

According to UH, recycling e-waste has not succeeded in the U.S. due to a fragmented recycling system, in which manufacturers, collectors and recyclers operate separately, driving up costs.

The UH team's research looks to change that.

In the study, the researchers modeled streamlined recycling efforts by mapping the interactions between manufacturers and independent recycling markets. Their dual-channel closed-loop supply chain (CLSC) model identified how these players can transition from competitors to partners, which can distribute profits more equitably and make recycling efforts more financially attractive.

According to UH, the research has particular significance due to the growing demand for electronic vehicles and their batteries.

“We can improve the performance of the entire recycling ecosystem and make the profit distribution more balanced,” Wang said in the release. “This ensures that the materials we need for EVs and advanced electronics stay right here in the U.S.”

“By making recycling work at scale, we aren’t just cleaning up waste,” Shi added. “We’re building a foundation that benefits both our national security and our economy.”

1PointFive signs latest deal, shares update on $1.3B carbon removal project

DAC deal

Houston-based 1PointFive, a subsidiary of Occidental Petroleum Corp., has secured another buyer of carbon dioxide removal credits for its $1.3 billion STRATOS project as it moves toward operation.

Bain & Company, a Boston-based consulting firm, has agreed to purchase 9,000 metric tons of carbon dioxide removal (CDR) credits from the direct air capture (DAC) facility over three years, according to a news release. DAC technology pulls CO2 from the air at any location, not just where carbon dioxide is emitted.

The deal is Bain's first purchase of DAC removal credits. The company has developed a program that helps clients purchase carbon credits from a range of carbon-removal technologies.

"We are proud to partner with 1PointFive and add them to our portfolio of engineered carbon removal technologies," Sam Israelit, Bain’s chief sustainability officer, said in the news release. "Their track record for developing DAC technology, coupled with their deep understanding of what it takes to deliver large-scale infrastructure projects, uniquely positions them to be a leader in this emerging segment.”

“We believe this agreement demonstrates continued momentum for the solution while supporting the development of vital domestic infrastructure,” Anthony Cottone, president and general manager of 1PointFive, added in the release.

Bain joins others like Microsoft, Amazon, AT&T, Airbus, the Houston Astros and the Houston Texans that have agreed to buy CDR credits from STRATOS.

The Texas-based STRATOS project is being developed through a joint venture with investment manager BlackRock and is designed to capture up to 500,000 metric tons of CO2 per year. The U.S Environmental Protection Agency approved Class VI permits for the project last year.

1PointFive says STRATOS is "progressing through start-up activities." The company shared in a LinkedIn post that Phase 1 of the project is expected to go online in Q2, with Phase 2 ramping up through the remainder of 2026.

Houston researcher develops efficient method to cool AI data centers

cool findings

A University of Houston professor has developed a new cooling method that can remove heat at least three times more effectively from AI data centers than current technologies.

Hadi Ghasemi, a distinguished professor of Mechanical & Aerospace Engineering at UH, published his findings in two articles in the International Journal of Heat and Mass Transfer. The findings solve a critical issue in the growing AI sector, according to UH.

High-powered AI data centers generate huge amounts of heat due to the GPU and operating systems they use with extreme power densities, which introduce complex thermal challenges. Traditionally, cooling methods, like microchannels, which use flow and spray cooling, have had limitations when exposed to extreme heat flux, according to UH.

Ghasemi’s research, however, found a more effective way to design thin-film evaporation structures to release heat from data centers and electronics at record performance.

Ghasem’s solution coupled topology optimization and AI modeling to determine the best shapes for thin film efficiency, ultimately landing on a branch-like structure—resembling a tree.

The model found that the “branches” needed to be about 50 percent solid and 50 percent empty space for optimum efficiency, and that they could sustain high heat fluxes with minimal thermal resistance.

“These structures could achieve high critical heat flux at much lower superheat compared to traditionally studied structures,” Ghasemi said in a news release. “The new structures can remove heat without having to get as hot as previous removal systems.

Ghasemi’s doctoral candidates, Amirmohammad Jahanbakhsh and Saber Badkoobeh Hezave, also worked on the project. The team believes their results show the impact of a physics-aware, AI design and can help ensure reliability, longevity and stability of AI data centers.

“Beyond achieving record performance, these new findings provide fundamental insight into the governing heat-transfer physics and establishes a rational pathway toward even higher thermal dissipation capacities,” Ghasemi added in the release

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